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Huizhou Liandajin Electronic Co., Ltd

Huizhou Liandajin Electronic Co., Ltd

 [Guangdong,China]

Business Type:Manufacturer

Main Markets: Africa , Americas , Asia , Caribbean , East Europe , Europe , Middle East , North Europe , Oceania , Other Markets , West Europe , Worldwide

Exporter:41% - 50%

Certs:ISO/TS16949, ISO13485, ISO14001, ISO9001, REACH, RoHS, UL

Description:One Stop Solutioner,PCB One Stop Solutioner,Designed Circuit Board

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Home > Products > PCB Manufacture > Rigid PCB > Designed Circuit Board PCB One Stop Solutioner
Designed Circuit Board PCB One Stop Solutioner
  • Designed Circuit Board PCB One Stop Solutioner
  • Designed Circuit Board PCB One Stop Solutioner
  • Designed Circuit Board PCB One Stop Solutioner
  • Designed Circuit Board PCB One Stop Solutioner
  • Designed Circuit Board PCB One Stop Solutioner
  • Designed Circuit Board PCB One Stop Solutioner

Designed Circuit Board PCB One Stop Solutioner

  • $0.01
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    Piece/Pieces
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Overview
Product Attributes

Model No.: LDJPCB-6343

Brand: LDJ

Min. Hole Size: 1mm

Material: FR4,CEM1,CEM3,Aluminum,High Frequency etc

Layers: 1-20 layers

Max. Board Size: 1200mm-600mm

Board Thickness: 0.2-6mm

Copper Thickness: 1/3oz-6oz

Surface Finish: HASL/LF,OSP Immersion Gold,Immersion Tin,Immersion Silver etc

Solder Mask: Green,White,Black,Blue,Red,Yellow

Min. Line Width: 0.15mm

Min. Line Spacing: 0.15mm

Supply Ability & Additional Information

Packaging: Blister vacuum packaging,carton box

Productivity: 60000 square meters per month

Transportation: Ocean,Land,Air,Express

Place of Origin: China

Supply Ability: 60000 Square Meters Per Month

Certificate: RoHs

Port: shenzhen,Hongkong

Payment Type: T/T,Paypal,Western Union

Incoterm: DDP,FOB,EXW,DDU

Packaging & Delivery
Selling Units:
Piece/Pieces
Package Type:
Blister vacuum packaging,carton box
Picture Example:
How to Manufacture PCB?The PCB Production Process is very complex,there are many manufacturing processes and manufactured equipment.Take the simple 2layers PCB for example: Material Cutting:  Cut the production work size according to the engineer design substrate specifications and layout drawings. Drilling: Drilling via holes on the board surface for connection between layers. Grinding machine: To remove the hole bust and dust on the board surface produced by drilling,and...

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